Industrial and Manufacturing Engineering Department faculty research focuses on theoretical and applied practices supporting the design and implementation of innovative and effective solutions for improving processes and systems in society, business, and industry.
Modified from ime.calpoly.edu
Submissions from 2006
Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, and Jason B. Baxter
The Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, and Wesley J. Dee
A Simplified Model for Ploughing Forces in Turning, Daniel Waldorf
Plotting a Bright Future for Manufacturing Education: Results of a Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, and Robert Bjurman
Investigation of the Lead-free Solder Joint Shear Performance, James Webster, Jianbiao Pan, and Brian J. Toleno
Submissions from 2005
Development of a Flying Eye: A Project-Based Learning Experience, Sema E. Alptekin, Dianne DeTurris, Daniel J. Macy, and Jon E. Ervin
PNL Applied to Economics, Barbara Diaz, Tomohiro Takagi, and Sema E. Alptekin
Optimization of the Fuzzy Logic Controller for an Autonomous UAV, Jon C. Ervin, Sema E. Alptekin, and Dianne J. DeTurris
The Effectiveness Analysis of the Online Tools for Engineering Faculty Needs, Ismail Fidan, Jianbiao Pan, and Leijun Li
Machine Vision Course for Manufacturing Engineering Undergraduate Students, Jose Macedo, Kurt Colvin, and Daniel Waldorf
Lead-free Solder Joint Reliability – State of the Art and Perspectives, Jianbiao Pan, Jyhwen Wang, and David M. Shaddock
The Limits of Reflexive Design in a Secrecy-Based Organization, Michael W. Stebbins, Tali Freed, A.B. (Rami) Shani, and Kenneth H. Doerr
Sequential deposition of copper/alumina composites, X. Wang, J. Ma, A. Maximenko, E.A. Olevsky, M.B. Stern, and B.M. Guenin
Stability analysis for forging of porous bodies, Xuan Wang, Eugene Olevsky, and Alain Molinari
Submissions from 2004
Work Flow Policy and Within-Worker and Between-Workers Variability in Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, and Xiaohua Zhou
Wire Bonding Challenges in Optoelectronics Packaging, Jianbiao Pan and Patrice Fraud
Effect of Chromium-Gold and Titanium-Titanium Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, and Jason Baxter
Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri
Lead-free Solder Joint Reliability – State of the Art and Perspectives, Jianbiao Pan, Jyhwen Wang, and David M. Shaddock
A Supply Chain Management Tool for Linking Courses in Manufacturing Engineering , Daniel Waldorf and Sema E. Alptekin
Submissions from 2002
A Taxonomy of Scheduling Problems in Semiconductor Device Test Operations, Tali Freed, Robert C. Leachman, and Kenneth H. Doerr
Submissions from 2001
Teaching Factory, Sema E. Alptekin, Reza Pouraghabagher, Patricia McQuaid, and Daniel Waldorf
Computer-Aided Engineering for Tool Design in Manufacturing Engineering Curriculum, Daniel J. Waldorf
Submissions from 2000
Product Flexibility in Selecting Manufacturing Planning and Control Strategy, Emine Persentili and Sema E. Alptekin
Plastic Solder Paste Stencil for Surface Mount Technology, Christopher K. Wong and Daniel Waldorf