Industrial and Manufacturing Engineering Department faculty research focuses on theoretical and applied practices supporting the design and implementation of innovative and effective solutions for improving processes and systems in society, business, and industry.
Modified from ime.calpoly.edu
Submissions from 2009
Finding and Optimising the Key Factors for the Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, and Chun-Yi Lee
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, and Brian J. Toleno
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability, Jianbiao Pan, Minh-Nhat Le, and Cuong Van Pham
Teaming Multi-level Classes on Industry Projects, Lizabeth Schlemer and Jose Macedo
Submissions from 2008
Techniques for Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin and Sema E. Alptekin
Drop Test Reliability of Lead-free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger
Enhancing Student Learning Through State-of-the-Art Systems Level Design and Implementation: The development of a lower division learning module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, and Albert Liddicoat
Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, and Nicolas Vickers
Work in Progress - Enhancing Student-Learning Through State-of-The-Art Systems Level Design and Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, and Lynne A. Slivovsky
Curricular Enhancement to Support Project-Based Learning in Computer and Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, and Lynne A. Slivovsky
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability, Jianbiao Pan, Minh-Nhat Le, and Cuong Van Pham
A Project-Based Electronics Manufacturing Laboratory Course for Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, and Dominic Dal Bello
Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, and Jianbiao Pan
Alternative Binder Carbide Tools for Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, and Daniel Norgan
Submissions from 2007
In-house development of scheduling decision support systems: case study for scheduling semiconductor device test operations, Tali Freed, K. H. Doerr, and T. Chang
Synthesis of gold micro- and nano-wires by infiltration and thermolysis, E.A. Olevsky, X. Wang, E. Bruce, M.B. Stern, S. Wildhack, and F. Aldinger
Fabrication of Net-Shape Functionally Graded Composites by Electrophoretic Deposition and Sintering: Modeling and Experimentation, E.A. Olevsky, X. Wang, A. Maximenko, and M.A. Meyers
Backward and Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, and Dennis Willie
The Benefits of Automatic Data Collection in the Fresh Produce Supply Chain, Ryan Charles Panos and Tali Freed
Fabrication of functionally graded 3A/5A zeolites by electrophoretic deposition, X. Wang, E. A. Olevsky, E. Bruce, M. B. Stern, and D. T. Hayhurst
Investigation of the Lead-free Solder Joint Shear Performance, James Webster, Jianbiao Pan, and Brian J. Toleno
Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, and Richard Savage
Submissions from 2006
Processing model for tungsten powders and extention to nanoscale size range, Randall M. German, J. Ma, X. Wang, and E. Olevsky
A Comparative Study of Various Loss Functions in the Economic Tolerance Design, JehNan Pan and Jianbiao Pan
Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste, Jianbiao Pan