Industrial and Manufacturing Engineering Department faculty research focuses on theoretical and applied practices supporting the design and implementation of innovative and effective solutions for improving processes and systems in society, business, and industry.

Modified from ime.calpoly.edu

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Submissions from 2017

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Modeling of selective laser sintering/ selective laser melting, Xuan Wang and Connor West

Submissions from 2016

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Mechanisms and solutions to the brittle solder joint in electroless Ni plating, Xuan Wang and C. Key Chung

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Densification of W-Ni-Fe Powders Using Laser Sintering, Xuan Wang, Matthew Wraith, Stephen Burke, Howard Rathbun, and Kyle DeVlugt

Submissions from 2015

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Measuring the effect of affordances on a crash cart medicine packaging, Javier de la Fuente, Daniel Tachibana, Kristen Leemon, Christine Liu, Colleen L. Twomey, Soma Roy, Laura Bix, and Scott Bisheff

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Warpage and shape distortion in laser metal sintering, Xuan Wang

Submissions from 2012

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Transformational Innovation: Reflections on How to Foster it in Engineering Education Systems, Roger Burton, Lizabeth Schlemer, and Linda Vanasupa

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Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, and Patrick Hyland

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Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, and Karen R. Bangs

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Work in Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, and Eric Kim

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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish, Julie Silk, Jianbiao Pan, and Mike Powers

Submissions from 2011

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Evolving a Summer Engineering Camp through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, and Teana Fredeen

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, and P. Hyland

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A Study of Solder Joint Failure Criteria, Jianbiao Pan and Julie Silk

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, and Patrick Hyland

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Design Projects with Out-of-Town Companies, Lizabeth Schlemer

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The Inside-Out Classroom: A Win-Win Strategy for Teaching with Technology, Daniel J. Waldorf and Lizabeth Schlemer

Submissions from 2010

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Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, and Linda Shepherd

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Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, and Linda Shepherd

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Using Sports Coaching Techniques to Enhance Project Based Learning Instruction, Lizabeth Schlemer and Faith Mimnaugh

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Testing the Test: Validity and Reliability of Senior Exit Exam, Lizabeth Schlemer and Daniel Waldorf

Submissions from 2009

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Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger

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Optimization of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan and Jianbiao Pan