Date of Award


Degree Name

MS in Mechanical Engineering


Mechanical Engineering


College of Engineering


William R. Murray

Advisor Department

Mechanical Engineering

Advisor College

College of Engineering


The focus of this document is on the gold ribbon bond testing and creation of a bonding map for the new gold ribbon Auto-Bonder at Keysight Technologies in Santa Rosa, California. The new Auto-Bonder replaces a nearly 50-year-old machine that no longer had any documentation for the original process of thin-film microchip ribbon bonding. The original process was developed in the early 1970s to provide an electrical connection from the top to the bottom of the microchip. The electrical connection takes the place of what would be a via in a modern silicon microchip. Gold wire bonding is a common practice for modern IC manufacturing, though only performed on the top surface of a chip or housing, and thus little research has been done on gold ribbon bonding.

The thin-film microchips are as thin as 0.010”, which introduces many difficulties of scale and work holding. The Auto-Bonder tooling set up is critical to understanding the complexity of the parts being handled, as there are many components that interact with and could alter the performance of the bond.

Final bond results were consolidated into a bonding map that illustrates the temperature and pressure required for good bonds across all thin-film chips used on the Auto-Bonder. Though most of the chip setpoints agreed with each other, the alumina substrate chip, model number 4924, had a different bonding map. Due to manufacturing requirements, the possible explanations for the bonding map discrepancies are discussed, not investigated.

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