Title

Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers

Author Info

Richard N. Savage, Silicon Valley Group, Inc., San Jose, CAFollow
Emir Gurer, Silicon Valley Group, Inc., San Jose, CA
Ed C. Lee, Silicon Valley Group, Inc., San Jose, CA

Recommended Citation

United States Patent Number: 6,242,364, June 5, 2001.

NOTE: At the time of publication, the author Richard Savage was not yet affiliated with Cal Poly.

Abstract

An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.

Disciplines

Materials Science and Engineering

Number of Pages

11

Publisher statement

Also available from the United States Patent and Trademark Office. Website: http://www.uspto.gov.