Faculty in the Orfalea College of Business conduct research that advances theory, informs practice, and improves our understanding of the complex interface between technology, human behavior, organizations and markets. Their research addresses real-world problems, involves students when appropriate, influences public and regulatory policies, and contributes to experiential-based learning. The departmental areas promote and maintain a multitude of opportunities for industry to advise and further the interests of students and faculty.
Modified from cob.calpoly.edu
Submissions from 2011
Review of Package Warning Labels and Their Effect on Consumer Behaviour with Insights to Future Anticounterfeit Strategy of Label and Communication Systems, John Spink, Jay Singh, and S. Paul Singh
Submissions from 2010
Measurement and Analysis of Truck and Rail Vibration Levels in Thailand, V. Chonhenchob, Paul Singh, Jay A. Singh, S. Sittipod, D. Swasdee, and Supoj Pratheepthinthong
Computer Simulation to Manage Lean Manufacturing Systems, Ahmed Deif
Modelling and analysis of dynamic capacity complexity in multi-stage production, Ahmed M. Deif and Hoda A. ElMaraghy
A dynamic approach to determine the product flow nature in apparel supply chain network, Mohammed Marufuzzaman and Ahmed M. Deif
Effect of Freeze-Thaw Cycling on the Compression Strength of Folding Cartons Made from Different Materials, Koushik Saha, Bruce Harte, Gary Burgess, and Sujeet Adudodla
Measurement, Analysis and Comparison of Drops Experienced by Packages in Inter-State and Intra-State Next Day Shipments in United States, K. Saha, Jay A. Singh, and S. P. Singh
Life Cycle Inventory Comparison of Paper and Plastic Based Packaging Systems for Strawberry Distribution, Jay A. Singh and Aric Krasowski
An Evaluation of the Ability of RFID Tags to Withstand Distribution of Fresh Produce in the RPC Pooling System, Jay A. Singh, S. P. Singh, K. Desautels, K. Saha, and E. Olsen
Evaluation of the Stress-Energy Methodology to Predict Transmitted Shock through Expanded Foam Cushions, J. Singh, L. Ignatova, E. Olsen, and P. Singh
Measurement and Analysis of ‘Small’ Packages in Next-day Air Shipments, Sher Paul Singh, Jay Singh, K. C. Chiang, and K. Saha
Measurement and Analysis of Temperature and Pressure in High Altitude Air Shipments, Sher Paul Singh, Jay Singh, J. Stallings, Gary J. Burgess, and K. Saha
Submissions from 2009
Is the test of senior friendly ⁄child resistant packaging ethical?, Laura Bix, Javier de la Fuente, Kenneth D. Pimple, and Eric Kou
Performance of Pre-Cut Lettuce Packaged in Biodegradable Film Formed on Commercial Vertical-Form-Fill-and-Seal Machines, J. Wyatt Brown, Keith Vorst, Shasta Palmer, and Jay A. Singh
Effect of Truck Vibration during Transport on Damage to Fresh Produce Shipments in Thailand, V. Chonhenchob, S. Sittipod, D. Swasdee, P. Rachtanapun, S. P. Singh, and Jay A. Singh
Dynamic modelling of reconfigurable manufacturing planning and control systems using supervisory control, Ahmed M. Deif and Waguih H. ElMaraghy
A Computer-Based Approach to Material and Process Selection Using Sustainability and Ecological Criteria, Manocher Djassemi
Computer-based approach to material and process selection, Manocher Djassemi
Emergence of Multitasking Machining Systems: Applications and Best Selection Practices, Manocher Djassemi
Flexography Printing Performance of PLA Film, J. Jacobson, Malcom Keif, Xiaoying Rong, Jay Singh, and Keith Vorst
Packaging Trends for Bottled Water, N. Noble, L. Paul, C. McMinimee, M. Mallett, and Jay Singh
Effect of Transport Vibration on Quality of Minimally Processed and Packaged Fresh-Cut Cantaloupe, Koushik Saha, S. Paul Singh, and Bruce Harte
A Study of the Effect of Pictorial Markings and Warning Labels on Handling of Packages in the DHL Single-Parcel Environment, Jay A. Singh, Sher Paul Singh, T. Voss, and K. Saha
Effect of Manufacturer's Joint Fastening Techniques on Compression Strength of Corrugated Fiberboard Boxes, Jay Singh, A. Attema, Eric Olsen, and Keith Vorst
Design-An Opportunity in Reducing Corrugated Fiberboard Carbon Footprint, Jay Singh, R. Kisch, J. Chhun, and Eric Olsen