College - Author 1

College of Engineering

Department - Author 1

Biomedical and General Engineering Department

Degree Name - Author 1

BS in Biomedical Engineering



Primary Advisor

Scott Hazelwood


To determine the stress analysis on the Nerve Cuff by MicroProbes, a finite element analysis was conducted. A simplified model was created in Solid Works using the geometry of the basic model of the nerve cuff. The solid model was then imported into Abaqus and the appropriate materials, boundary conditions, and loads were designated. Initially a tensile test simulation was conducted using a tensile force of 2.87 Newtons. The maximum stress experienced with this tensile force was 8.225 MPa which was greater than the ultimate tensile strength of 5.5 MPa of Silicone. Both the actual tensile test and the tensile test simulation showed that the nerve cuff would fracture during a tensile load of 2.87 Newtons. Additionally the tensile test validated the finite element analysis model because the maximum experienced stress on the simulation was on the same order of magnitude as the actual experienced stress during an actual tensile test. Next, loads and boundary conditions were applied to simulate the nerve cuff during actual use. The maximum stress in the silicone component and platinum iridium component of the nerve cuff were 1.131 and 2.412 MPa respectively. These are both lower than the ultimate strength of silicone and platinum iridium, showing the nerve cuff would remain intact and not fail during regular use. This model can be enhanced and further used to eventually help get FDA (Food and Drug Administration) approval of the nerve cuff for human use.