Postprint version. Published in Journal of Electronic Materials, Volume 32, Issue 11, November 1, 2003, pages 1257-1264.
The definitive version is available at https://doi.org/10.1007/s11664-003-0020-7.
Mechanical incorporation of metallic particles in the Sn-Ag-based solder resulted in various intermetallic compound (IMC) morphologies around these particles during reflow. Unlike with the Ni particles, the IMCs formed around Cu and Ag particles are relatively insensitive to reflow profiles employed. The IMC formed around the Ni particles ranges from “sunflower” morphology to “blocky” morphology with increasing time and temperature above liquidus during the heating part of the reflow profile. Mechanical properties, such as simple shear strength and creep behavior, of these composite solders were affected by the IMC morphologies in the composite solders investigated. Sunflower-shaped IMC formed around an Ni particles resulted in higher simple shear strength and better creep properties.
Materials Science and Engineering
The original version is available at http://www.springerlink.com.