Industrial and Manufacturing Engineering Department
BS in Electrical Engineering
Electronics are getting more and more advanced. Companies are designing their product to be more powerful, but at the same time they are designing them to be smaller and more user friendly. Heat becomes a major factor with the limited amount of surface area. The objective of this project is to measure the junction temperature of three system on chips (SoC) under various loading conditions and their time constant. The junction temperature was measured based on the diode’s I-V linear relationship. Both calibration and measurement of the junction temperature were conducted for three different SoC packages. The measurement results can be compared with the simulation results from a thermal design program such as Icepak or Solidworks. The results can also be used to optimize the board design.