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Submissions from 2017

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Modeling of selective laser sintering/ selective laser melting, Xuan Wang and Connor West

Submissions from 2016

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Mechanisms and solutions to the brittle solder joint in electroless Ni plating, Xuan Wang and C. Key Chung

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Densification of W-Ni-Fe Powders Using Laser Sintering, Xuan Wang, Matthew Wraith, Stephen Burke, Howard Rathbun, and Kyle DeVlugt

Submissions from 2015

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Measuring the effect of affordances on a crash cart medicine packaging, Javier de la Fuente, Daniel Tachibana, Kristen Leemon, Christine Liu, Colleen L. Twomey, Soma Roy, Laura Bix, and Scott Bisheff

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Warpage and shape distortion in laser metal sintering, Xuan Wang

Submissions from 2012

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Transformational Innovation: Reflections on How to Foster it in Engineering Education Systems, Roger Burton, Lizabeth Schlemer, and Linda Vanasupa

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Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, and Patrick Hyland

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Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, and Karen R. Bangs

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Work in Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, and Eric Kim

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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish, Julie Silk, Jianbiao Pan, and Mike Powers

Submissions from 2011

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Evolving a Summer Engineering Camp through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, and Teana Fredeen

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, and P. Hyland

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A Study of Solder Joint Failure Criteria, Jianbiao Pan and Julie Silk

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, and Patrick Hyland

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Design Projects with Out-of-Town Companies, Lizabeth Schlemer

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The Inside-Out Classroom: A Win-Win Strategy for Teaching with Technology, Daniel J. Waldorf and Lizabeth Schlemer

Submissions from 2010

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Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, and Linda Shepherd

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Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, and Linda Shepherd

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Using Sports Coaching Techniques to Enhance Project Based Learning Instruction, Lizabeth Schlemer and Faith Mimnaugh

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Testing the Test: Validity and Reliability of Senior Exit Exam, Lizabeth Schlemer and Daniel Waldorf

Submissions from 2009

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Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger

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Optimization of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan and Jianbiao Pan