Date

11-2012

Degree Name

BS in Mechanical Engineering

Department

Mechanical Engineering Department

Advisor(s)

Sarah Harding

Abstract

Applied Materials is a global company that designs equipment for use in the semiconductor manufacturing industry. The scope of this project covers process chambers used for depositing thin chemical films onto silicon wafers. These processes must take place in particularly specific environments– including extremely low pressures and high temperatures. One challenge engineers face when designing these processes is carefully controlling the thermal behavior of silicon wafers. Typically, behavior is predicted using time consuming and computationally expensive CFD simulations. We have been asked to address this issue with a simpler, faster model which will allow engineers to reduce the total number of full CFD simulations required when iterating toward a final design.

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