Abstract

Optical emission spectroscopy (OES) has proven to be a valuable tool in the developmrent and production of state-of-the-art semiconductor devices. Application to the plasma etching of a variety of materials necessary for integrated circuit fabrication is discussed, with particular emphasis placed on etch endpoint analysis. The utility of OES techniques in monitoring photolithographic processes is also presented.

Disciplines

Materials Science and Engineering

Publisher statement

The definitive version is available at http://www.mrs.org/s_mrs/sec.asp?CID=11820&DID=204472.

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URL: http://digitalcommons.calpoly.edu/mate_fac/99