Recommended Citation
Postprint version. Published in Lead-Free Soldering, January 1, 2007, pages 173-197. Copyright © 2007 Springer. The definitive version is available at http://dx.doi.org/10.1007/978-0-387-68422-2_7.
Abstract
In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.
Disciplines
Industrial Engineering | Manufacturing
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