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Submissions from 2013

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Project Based Learning in Engineering Economics: Teaching Advanced Topics Using a Stock Price Prediction Model, Lizabeth Schlemer

Submissions from 2012

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Transformational Innovation: Reflections on How to Foster it in Engineering Education Systems, Roger Burton, Lizabeth Schlemer, and Linda Vanasupa

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Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging, Mike Powers, Jianbiao Pan, Julie Silk, and Patrick Hyland

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Integrating Courses Through Project Based Learning, Lizabeth Schlemer, Sema E. Alptekin, and Karen R. Bangs

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Work in Progress: Outreach Assessment: Measuring Engagement, Lizabeth Schlemer, John Oliver, Katherine Chen, Sophia Rodriguez Mata, and Eric Kim

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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish, Julie Silk, Jianbiao Pan, and Mike Powers

Submissions from 2011

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Evolving a Summer Engineering Camp through Assessment, Katherine Chen, Lizabeth Schlemer, Heather Scott Smith, and Teana Fredeen

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, J. Silk, M. Powers, and P. Hyland

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A Study of Solder Joint Failure Criteria, Jianbiao Pan and Julie Silk

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Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Julie Silk, Mike Powers, and Patrick Hyland

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Design Projects with Out-of-Town Companies, Lizabeth Schlemer

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The Inside-Out Classroom: A Win-Win Strategy for Teaching with Technology, Daniel J. Waldorf and Lizabeth Schlemer

Submissions from 2010

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Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors, Albert Liddicoat, Jianbiao Pan, James G. Harris, Gary Perks, and Linda Shepherd

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Assessing Curriculum Improvement Through Senior Projects, Jianbiao Pan, Albert Liddicoat, James G. Harris, and Linda Shepherd

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Using Sports Coaching Techniques to Enhance Project Based Learning Instruction, Lizabeth Schlemer and Faith Mimnaugh

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Testing the Test: Validity and Reliability of Senior Exit Exam, Lizabeth Schlemer and Daniel Waldorf

Submissions from 2009

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Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger

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Optimization of Engineering Tolerance Design Using Revised Loss Functions, Jeh-Nan Pan and Jianbiao Pan

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Finding and Optimising the Key Factors for the Multiple-Response Manufacturing Process, Jeh-Nan Pan, Jianbiao Pan, and Chun-Yi Lee

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Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints, Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, and Brian J. Toleno

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The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability, Jianbiao Pan, Minh-Nhat Le, and Cuong Van Pham

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Teaming Multi-level Classes on Industry Projects, Lizabeth Schlemer and Jose Macedo

Submissions from 2008

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Techniques for Developing Large Scale Fuzzy Logic Systems, Jon C. Ervin and Sema E. Alptekin

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Drop Test Reliability of Lead-free Chip Scale Packages, Andrew Farris, Jianbiao Pan, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger

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Enhancing Student Learning Through State-of-the-Art Systems Level Design and Implementation: The development of a lower division learning module, James G. Harris, Dominic Dal Bello, Jianbiao Pan, and Albert Liddicoat

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Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board, Michael Krist, Jianbiao Pan, Andrew Farris, and Nicolas Vickers

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Work in Progress - Enhancing Student-Learning Through State-of-The-Art Systems Level Design and Implementation, Albert A. Liddicoat, Jianbiao Pan, James G. Harris, Dominic J. Dal Bello, and Lynne A. Slivovsky

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Curricular Enhancement to Support Project-Based Learning in Computer and Electrical Engineering, Albert Liddicoat, Jianbiao Pan, James G. Harris, and Lynne A. Slivovsky

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The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability, Jianbiao Pan, Minh-Nhat Le, and Cuong Van Pham

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A Project-Based Electronics Manufacturing Laboratory Course for Lower-Division Engineering Students, Jianbiao Pan, Albert Liddicoat, James G. Harris, and Dominic Dal Bello

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Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies, Nicholas Vickers, Kyle Rauen, Andrew Farris, and Jianbiao Pan

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Alternative Binder Carbide Tools for Machining Superalloys, Daniel J. Waldorf, Michael Stender, Scott Liu, and Daniel Norgan

Submissions from 2007

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In-house development of scheduling decision support systems: case study for scheduling semiconductor device test operations, Tali Freed, K. H. Doerr, and T. Chang

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Backward and Forward Compatibility, Jianbiao Pan, Jasbir Bath, Xiang Zhou, and Dennis Willie

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The Benefits of Automatic Data Collection in the Fresh Produce Supply Chain, Ryan Charles Panos and Tali Freed

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Investigation of the Lead-free Solder Joint Shear Performance, James Webster, Jianbiao Pan, and Brian J. Toleno

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Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes, Brian Wright, Jianbiao Pan, and Richard Savage

Submissions from 2006

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A Comparative Study of Various Loss Functions in the Economic Tolerance Design, JehNan Pan and Jianbiao Pan

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Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste, Jianbiao Pan

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Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, and Jason B. Baxter

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The Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Strength, Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, and Wesley J. Dee

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A Simplified Model for Ploughing Forces in Turning, Daniel Waldorf

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Plotting a Bright Future for Manufacturing Education: Results of a Brainstorming Session, Daniel Waldorf, Sema E. Alptekin, and Robert Bjurman

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Investigation of the Lead-free Solder Joint Shear Performance, James Webster, Jianbiao Pan, and Brian J. Toleno

Submissions from 2005

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Development of a Flying Eye: A Project-Based Learning Experience, Sema E. Alptekin, Dianne DeTurris, Daniel J. Macy, and Jon E. Ervin

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PNL Applied to Economics, Barbara Diaz, Tomohiro Takagi, and Sema E. Alptekin

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Optimization of the Fuzzy Logic Controller for an Autonomous UAV, Jon C. Ervin, Sema E. Alptekin, and Dianne J. DeTurris

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The Effectiveness Analysis of the Online Tools for Engineering Faculty Needs, Ismail Fidan, Jianbiao Pan, and Leijun Li

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Machine Vision Course for Manufacturing Engineering Undergraduate Students, Jose Macedo, Kurt Colvin, and Daniel Waldorf

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Lead-free Solder Joint Reliability – State of the Art and Perspectives, Jianbiao Pan, Jyhwen Wang, and David M. Shaddock

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The Limits of Reflexive Design in a Secrecy-Based Organization, Michael W. Stebbins, Tali Freed, A.B. (Rami) Shani, and Kenneth H. Doerr

Submissions from 2004

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Work Flow Policy and Within-Worker and Between-Workers Variability in Performance, Kenneth Howard Doerr, Tali Freed, Terence R. Mitchell, Chester A. Schriesheim, and Xiaohua Zhou

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Wire Bonding Challenges in Optoelectronics Packaging, Jianbiao Pan and Patrice Fraud

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Effect of Chromium-Gold and Titanium-Titanium Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability, Jianbiao Pan, Robert M. Pafchek, Frank F. Judd, and Jason Baxter

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Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri

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Lead-free Solder Joint Reliability – State of the Art and Perspectives, Jianbiao Pan, Jyhwen Wang, and David M. Shaddock

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A Supply Chain Management Tool for Linking Courses in Manufacturing Engineering , Daniel Waldorf and Sema E. Alptekin

Submissions from 2002

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A Taxonomy of Scheduling Problems in Semiconductor Device Test Operations, Tali Freed, Robert C. Leachman, and Kenneth H. Doerr

Submissions from 2001

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Teaching Factory, Sema E. Alptekin, Reza Pouraghabagher, Patricia McQuaid, and Daniel Waldorf

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Computer-Aided Engineering for Tool Design in Manufacturing Engineering Curriculum, Daniel J. Waldorf

Submissions from 2000

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Product Flexibility in Selecting Manufacturing Planning and Control Strategy, Emine Persentili and Sema E. Alptekin

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Plastic Solder Paste Stencil for Surface Mount Technology, Christopher K. Wong and Daniel Waldorf

Submissions from 1999

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Industrial Engineering Made Simple, Deena Daggett and Sema E. Alptekin

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Scheduling Semiconductor Device Test Operations on Multihead Testers, Tali Freed and Robert C. Leachman

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Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, and Alejandro Quintero

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Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri

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Gauge Repeatability & Reproducibility Study for a 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri

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SimTrainer: A Management Training Tool, Wade Stark and Sema E. Alptekin

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An Evaluation of Ploughing Models for Orthogonal Machining, Daniel J. Waldorf, Richard E. DeVor, and Shiv G. Kapoor

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Worn Tool Forces Based on Ploughing Stresses, Daniel Waldorf, Shiv G. Kapoor, and Richard E. Devor

Submissions from 1998

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Fuzzy Logic Control of a Model Airplane, Jon C. Ervin and Sema E. Alptekin

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Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates, Jianbiao Pan, Gregory L. Tonkay, and Alejandro Quintero

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A Slip-Line Field for Ploughing During Orthogonal Cutting, Daniel J. Waldorf, Richard E. DeVor, and Shiv. G. Kapoor

Submissions from 1997

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Development of a Mechatronics Design Studio, Sema E. Alptekin

Submissions from 1996

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Preparing the Leaders for Mechatronics Education, Sema E. Alptekin

Submissions from 1995

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A Psychological Perspective on Service Segmentation Models: The Significance of Accounting for Consumers' Perceptions of Waiting and Service, Ziv Carmon, J. George Shanthikumar, and Tali F. Carmon

Submissions from 1994

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Error Recovery in Intelligent Robotic Workcells, R. D. Borchelt and Sema E. Alptekin

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A preliminary model for lot sizing In semiconductor manufacturing, Tali F. Carmon and Steven Nahmias

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The Importance of Considering Size Effect Along the Cutting Edge in Predicting the Effective Lead Angle for Turning, William J. Endres and Daniel Waldorf

Submissions from 1993

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Set-up saving schemes for printed circuit boards assembly, Oded Z. Maimon, Ezey M. Dar-El, and Tali F. Carmon

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Integration of Simulation Modeling and Computer Aided Production Management in Computer Integrated Enterprise, Emine Persentili and Sema E. Alptekin

Submissions from 1992

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Artificial Neural Networks for Robotics Coordinate Transformation, Stephen Aylor, Luis Rabelo, and Sema E. Alptekin

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On Capacity Modeling for Production Planning with Alternative Machine Types, Robert C. Leachman and Tali F. Carmon

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Automatic Recognition of Tool Wear on a Face Mill Using a Mechanistic Modeling Approach, Daniel Waldorf, Shiv G. Kapoor, and Richard E. DeVor

Submissions from 1991

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Tardiness Heuristic For Scheduling Flexible Manufacturing Systems, Ali S. Kiran, Sema E. Alptekin, and A. Celal Kaplan

Submissions from 1990

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A Suggested Model Program for CIM Education, Sema E. Alptekin

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Adaptive Scheduling and Control Using Artificial Neural Networks and Expert Systems For A Hierarchical/Distributed FMS Architecture, Luis Carlos Rabelo and Sema E. Alptekin

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Synergy of Artificial Neural Networks and Knowledge-Based Expert Systems for Intelligent FMS Scheduling, Luis Carlos Rabelo, Sema E. Alptekin, and Ali S. Kiran

Submissions from 1989

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Group set-up for printed circuit board assembly, Tali F. Carmon, Oded Z. Maimon, and Ezey M. Dar-El

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Integrating Scheduling and Control Functions in Computer Integrated Manufacturing Using Artificial Intelligence, Luis Carlos Rabelo and Sema E. Alptekin

Submissions from 1988

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A Systematic Transition to Flexible Manufacturing, Sema E. Alptekin and Daniel L. Webber

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Proposed Scheduling Methods for Printed Circuit Board Assembly, Tali Freed, Ezey M. Dar-El, and Oded Z. Maimon